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Magazine Name : Ieee Transactions On Components Hybrids And Manufacturing Technology

Year : 1991 Volume number : 14 Issue: 04

Investigations Of Laser Soldered Tab Inner Lead Contacts (Article)
Subject: Laser Soldering , Tab , Inner Lead Contacts , Lead Contacts
Author: Elke Zakel      Herbert Reichl     
page:      672 - 679
Fine Pitch Wire Bonding Development Using A New Multipurpose, Multipad Pitch Test Die (Article)
Subject: Bonding , Multipurpose Control , Fine Pitch Wire , Multipad Pitch Test Die
Author: Bill Shu     
page:      680 - 690
Metallurgical Changes In Tin-Lead Platings Due To Heat Aging (Article)
Subject: Metallurgical Changes , Tin-Lead Platings , Heat Aging , Intermetallic Compound
Author: Raymond J. Geckle     
page:      691 - 697
Composite Solders (Article)
Subject: Composite Solder , Surface , Heterogeneous , Intermetallic
Author: Jose Calderon      James L. Marshall     
page:      698 - 702
Microstructural Evolution In Sn/Pb Solder And Pb/Ag Thick Film Conductor Metallization (Article)
Subject: Microstructural Evolution , Sn/Pd Solder , Thick Film , Metallization
Author: Kuo-Chuan Liu      Jenq-Gong Duh     
page:      703 - 707
Improved Thermal Conductivity In Microelectronic Encapsulants (Article)
Subject: Thermal Conductivity , Microelectronics , Encapsulant
Author: Philip Procter      Jitka Solc     
page:      708 - 713
Hermetic Sealing Process With Atmospheric Pressure Vibration For Lsi Packages (Article)
Subject: Hermetic Compressor , Sealing , Atmospheric Pressure , Lsi
Author: Ken'Ichi Mizuishi      Masahide Kokuda      Yuuji Fujita     
page:      714 - 717
Mechanical Behavior Of Ceramic Capacitors (Article)
Subject: Mechanical Behaviour , Ceramics , Capacitors , Thermal Shock
Author: Chowdary Ramesh Koripella     
page:      718 - 724
Megahertz Transformers For High Density Power Conversion (Article)
Subject: High Density , Power Conversion , Copper Losses , Leakage Inductances
Author: Alexander J. Yerman      Waseem A. Roshen     
page:      725 - 731
Microwave Dielectric Constant Of A Low Temperature Cofired Ceramic (Article)
Subject: Microwave , Dielectric Constant , Low Temperature , Cofired Ceramic
Author: Kevin A. Leahy      John W. Gipprich     
page:      732 - 737
Solder Interconnections For Smt Selective Line Coupling (Article)
Subject: Smt , Interconnections , Solder Interconnections , Smt Selective Line Coupling
Author: Anthony Parla      George Procopio     
page:      738 - 743
The Design Of The Es/9000 Module (Article)
Subject: Tcm , Es/9000 Module , Original 3090 Technology
Author: Evan E. Davidson      George A. Katopis      L. L. Wu     
page:      744 - 748
The Per-Unit-Length Capacitance Matrix Of Flaring Vlsi Packaging Interconnections (Article)
Subject: Vlsi , Packaging , Capacitance , Interconnections
Author: Ahmed Omer      Andreas C. Cangellaris      John L. Prince     
page:      749 - 754
3-D Electromagnetic Field Analysis Of Interconnections In Copper-Polyimide Multichip Modules (Article)
Subject: Electromagnetic Fields , Interconnections , Copper-Polyimide , Multichip Modules
Author: Shin-Ichi Sasaki      Takaaki Ohsaki     
page:      755 - 760
Experimental Electrical Characterization Of Interconnects And Discontinuities In High-Speed Digital Systems (Article)
Subject: Electrical Characterization , Interconnects , Discontinuity , High-Speed Digital Systems
Author: Michael B. Steer      Paul D. Franzon     
page:      761 - 765
Combination Of Numerical And Experimental Methods For Stress Analysis Of Small Electronic Components (Article)
Subject: Combinational Experimentation , Experimental Methodology , Stress Analysis , Electronic Components
Author: Jurgen Villain      Hartwig Borner     
page:      766 - 770
Compliance Metrics For The Inclined Gull-Wing, Spider J-Bend, And Spider Gull-Wing Lead Designs For Surface Mount Components (Article)
Subject: Compliance Metrics , Gull-Wing , Spider Gull-Wing Lead , Spider J-Bend
Author: Robert W. Kotlowitz      Lisa R. Taylor     
page:      771 - 779
Cosintering Process For Glass-Ceramic/Copper Multilayer Ceramic Substrate (Article)
Subject: Glass Ceramics , Multilayer Cermic Capacitor , Ceramic Substrates , Cosintering Process
Author: Raj N. Master      Rao R. Tummala      L. Wynn Herron     
page:      780 - 783
Advanced Ceramic Substrates For Multichip Modules With Multilevel Thin Film Interconnects (Article)
Subject: Advanced Ceramics , Multichip Modules , Multilevel Systems , Thin Film
Author: Ellen S. Tormey      Frank J. Bachner      Brian C. Foster     
page:      784 - 789
High Density Microelectronic Packaging With Thick Film Hermetic Packages (Article)
Subject: High Density , Microelectronic Packages , Thick Film , Hermetic Packages
Author: Frank A. Lindberg     
page:      790 - 797
A Process For Surface Texturing Of Kapton Polyimide To Improve Adhesion To Metals (Article)
Subject: Polyimide , Process For Surface , Texturing Of Kapton , Adhesion Control
Author: John C. Houge      Robert L.D. Zenner      Nanayakkara L.D. Somasiri     
page:      798 - 801
Dust Test Results On Multicontact Circuit Board Connectors (Article)
Subject: Circuit Board Connectors , Connector Contacts , Dust Test Results , Multicontact
Author: Douglas G. Denure      Edward S. Sproles Jr.     
page:      802 - 808
The Role Of Plastic Package Adhesion In Performance (Article)
Subject: Package Performance , Adhesion , Plastic-Packaged , Role Of Plastic
Author: Samuel Kim     
page:      809 - 817
Causes Of Cracks In Smd And Type Specific Remedies (Article)
Subject: Package Performance , Cracking , Cracks In Smd , Specific Remedies
Author: Susumu Omi      Kazuya Fujita      Takamichi Maeda     
page:      818 - 823
Thermal Cycling Induced Plastic Deformation In Solder Joints. Ii. Accumulated Deformation In Through Hole Joints (Article)
Subject: Thermal Cycle Stability , Plastic Deformation , Solder Joint Reliability , Accumulated Thermal Effect
Author: Tsung-Yi Pan     
page:      824 - 832
Influence Of Environment On The Fatigue Of Pb-Sn Solder Joints (Article)
Subject: Fatigue , Pb-Sn Alloy , Solder Joint Reliability , Influence Of Environment
Author: Hans Conrad      A.F. Sprecher      Dae Young Jung      Zhenfeng Guo     
page:      833 - 837
Brittle Cracks Induced In Alsi Wire By The Ultrasonic Bonding Tool Vibration (Article)
Subject: Brittleness , Cracks Induced , Alsi Wire , Ultrasonic Bonding Tool Vibration
Author: C. E Miller      Raymond T. Fitzsimmons     
page:      838 - 842
Resistance Drift In Aluminum To Gold Ultrasonic Wire Bonds (Article)
Subject: Gold-Aluminum Bonds , Resistance , Drift , Ultrasonic Bonding Tool Vibration
Author: Robert M. Murcko      Robin A. Susko      John M. Lauffer     
page:      843 - 847
High Mechanical Reliability Of Back-Ground Gaas Lsi Chips With Low Thermal Resistance (Article)
Subject: Gaas Lsi Chips , Thermal Resistance , Back-Ground , High Mechanical Reliability
Author: Masanori Nishiguchi      Noboru Goto      Hideaki Nishizawa     
page:      848 - 854
Study Of Temperature Parameter On The Thermosonic Gold Wire Bonding Of High-Speed Cmos (Article)
Subject: Gold Wire , High-Speed Cmos , Temperature Parameter , Thermosonic
Author: Kar P. Foong      Thiam L. Lim      G.E. Lim      Shze J. Hu     
page:      855 - 858
Measurement And Modeling Of In Situ Lead Stiffness Of Surface Mounted Packages (Article)
Subject: Pcb , Test Method , Surface Mount Technology , Package Modeling
Author: Praveen Jain      W.E. Jahsman      Elaine Pope     
page:      859 - 869
A Comprehensive Approach For The Analysis Of Package Induced Stress In Ic'S Using Analytical And Empirical Methods (Article)
Subject: Fem Model , Ic Packages , Empirical Models
Author: Rajendra D. Pendse     
page:      870 - 873
A Bonding Technique For Thin Gaas Dice With Via Holes Using Gold-Tin Composites (Article)
Subject: Bonding Technique , Thin Gaas Dice , Gold-Tin Composites , Via Holes
Author: Chen Y. Wang      Chin C. Lee     
page:      874 - 878
Correlations Of Dynamic Mechanical Measurements To The Stress Formation By Molding Compounds (Article)
Subject: Correlation , Dynamic Mechanical Properties , Molding Compounds , Stress Formation
Author: Raimund Schwarz      Winfried Holzapfel      Manfred Bogner      Ferdinand Quella     
page:      879 - 885
Insulated Metal Substrates For The Fabrication Of A Half-Bridge Power Hybrid (Article)
Subject: Metal Substrate , Fabrication , Half-Bridge Converter , Hybrid Power System
Author: R. Wayne Johnson      Riley M. Duren     
page:      886 - 893
Downward Laser Trimming Of Thick Film Resistors (Article)
Subject: Analog Networks , Computer Simulations , Track Design , Thick Film Technology
Author: M. Satyam      T. Badri Narayana      K. Ramkumar     
page:      894 - 899
Die Punch Test Study And Relationship To Delta Vbe (Article)
Subject: Relationship , Die Punch Test , Power Transistors , Delta Vbe
Author: Lorena Paredes-Casillas      Mariano Aceves-Mijares     
page:      900 - 903
A New Method To Determine Contamination Limited Yield (Article)
Subject: Determine Layer , Contamination , New Method , Limited Yield Modeling
Author: Lewis Hecht     
page:      904 - 905