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Your search returned 38 records. Click on the hyperlinks to view further details of Titles.. |
Magazine Name : Ieee Transactions On Components Hybrids And Manufacturing Technology
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Year : 1991 Volume number : 14 Issue: 04 |
Investigations Of Laser Soldered Tab Inner Lead Contacts
(Article)
Subject:
Laser Soldering
,
Tab
,
Inner Lead Contacts
,
Lead Contacts
Author:
Elke
Zakel
Herbert
Reichl
page:
672
-
679
Fine Pitch Wire Bonding Development Using A New Multipurpose, Multipad Pitch Test Die
(Article)
Subject:
Bonding
,
Multipurpose Control
,
Fine Pitch Wire
,
Multipad Pitch Test Die
Author:
Bill
Shu
page:
680
-
690
Metallurgical Changes In Tin-Lead Platings Due To Heat Aging
(Article)
Subject:
Metallurgical Changes
,
Tin-Lead Platings
,
Heat Aging
,
Intermetallic Compound
Author:
Raymond J.
Geckle
page:
691
-
697
Composite Solders
(Article)
Subject:
Composite Solder
,
Surface
,
Heterogeneous
,
Intermetallic
Author:
Jose
Calderon
James L.
Marshall
page:
698
-
702
Microstructural Evolution In Sn/Pb Solder And Pb/Ag Thick Film Conductor Metallization
(Article)
Subject:
Microstructural Evolution
,
Sn/Pd Solder
,
Thick Film
,
Metallization
Author:
Kuo-Chuan
Liu
Jenq-Gong
Duh
page:
703
-
707
Improved Thermal Conductivity In Microelectronic Encapsulants
(Article)
Subject:
Thermal Conductivity
,
Microelectronics
,
Encapsulant
Author:
Philip
Procter
Jitka
Solc
page:
708
-
713
Hermetic Sealing Process With Atmospheric Pressure Vibration For Lsi Packages
(Article)
Subject:
Hermetic Compressor
,
Sealing
,
Atmospheric Pressure
,
Lsi
Author:
Ken'Ichi
Mizuishi
Masahide
Kokuda
Yuuji
Fujita
page:
714
-
717
Mechanical Behavior Of Ceramic Capacitors
(Article)
Subject:
Mechanical Behaviour
,
Ceramics
,
Capacitors
,
Thermal Shock
Author:
Chowdary Ramesh
Koripella
page:
718
-
724
Megahertz Transformers For High Density Power Conversion
(Article)
Subject:
High Density
,
Power Conversion
,
Copper Losses
,
Leakage Inductances
Author:
Alexander J.
Yerman
Waseem A.
Roshen
page:
725
-
731
Microwave Dielectric Constant Of A Low Temperature Cofired Ceramic
(Article)
Subject:
Microwave
,
Dielectric Constant
,
Low Temperature
,
Cofired Ceramic
Author:
Kevin A.
Leahy
John W.
Gipprich
page:
732
-
737
Solder Interconnections For Smt Selective Line Coupling
(Article)
Subject:
Smt
,
Interconnections
,
Solder Interconnections
,
Smt Selective Line Coupling
Author:
Anthony
Parla
George
Procopio
page:
738
-
743
The Design Of The Es/9000 Module
(Article)
Subject:
Tcm
,
Es/9000 Module
,
Original 3090 Technology
Author:
Evan E.
Davidson
George A.
Katopis
L. L.
Wu
page:
744
-
748
The Per-Unit-Length Capacitance Matrix Of Flaring Vlsi Packaging Interconnections
(Article)
Subject:
Vlsi
,
Packaging
,
Capacitance
,
Interconnections
Author:
Ahmed
Omer
Andreas C.
Cangellaris
John L.
Prince
page:
749
-
754
3-D Electromagnetic Field Analysis Of Interconnections In Copper-Polyimide Multichip Modules
(Article)
Subject:
Electromagnetic Fields
,
Interconnections
,
Copper-Polyimide
,
Multichip Modules
Author:
Shin-Ichi
Sasaki
Takaaki
Ohsaki
page:
755
-
760
Experimental Electrical Characterization Of Interconnects And Discontinuities In High-Speed Digital Systems
(Article)
Subject:
Electrical Characterization
,
Interconnects
,
Discontinuity
,
High-Speed Digital Systems
Author:
Michael B.
Steer
Paul D.
Franzon
page:
761
-
765
Combination Of Numerical And Experimental Methods For Stress Analysis Of Small Electronic Components
(Article)
Subject:
Combinational Experimentation
,
Experimental Methodology
,
Stress Analysis
,
Electronic Components
Author:
Jurgen
Villain
Hartwig
Borner
page:
766
-
770
Compliance Metrics For The Inclined Gull-Wing, Spider J-Bend, And Spider Gull-Wing Lead Designs For Surface Mount Components
(Article)
Subject:
Compliance Metrics
,
Gull-Wing
,
Spider Gull-Wing Lead
,
Spider J-Bend
Author:
Robert W.
Kotlowitz
Lisa R.
Taylor
page:
771
-
779
Cosintering Process For Glass-Ceramic/Copper Multilayer Ceramic Substrate
(Article)
Subject:
Glass Ceramics
,
Multilayer Cermic Capacitor
,
Ceramic Substrates
,
Cosintering Process
Author:
Raj N.
Master
Rao R.
Tummala
L. Wynn
Herron
page:
780
-
783
Advanced Ceramic Substrates For Multichip Modules With Multilevel Thin Film Interconnects
(Article)
Subject:
Advanced Ceramics
,
Multichip Modules
,
Multilevel Systems
,
Thin Film
Author:
Ellen S.
Tormey
Frank J.
Bachner
Brian C.
Foster
page:
784
-
789
High Density Microelectronic Packaging With Thick Film Hermetic Packages
(Article)
Subject:
High Density
,
Microelectronic Packages
,
Thick Film
,
Hermetic Packages
Author:
Frank A.
Lindberg
page:
790
-
797
A Process For Surface Texturing Of Kapton Polyimide To Improve Adhesion To Metals
(Article)
Subject:
Polyimide
,
Process For Surface
,
Texturing Of Kapton
,
Adhesion Control
Author:
John C.
Houge
Robert L.D.
Zenner
Nanayakkara L.D.
Somasiri
page:
798
-
801
Dust Test Results On Multicontact Circuit Board Connectors
(Article)
Subject:
Circuit Board Connectors
,
Connector Contacts
,
Dust Test Results
,
Multicontact
Author:
Douglas G.
Denure
Edward S.
Sproles Jr.
page:
802
-
808
The Role Of Plastic Package Adhesion In Performance
(Article)
Subject:
Package Performance
,
Adhesion
,
Plastic-Packaged
,
Role Of Plastic
Author:
Samuel
Kim
page:
809
-
817
Causes Of Cracks In Smd And Type Specific Remedies
(Article)
Subject:
Package Performance
,
Cracking
,
Cracks In Smd
,
Specific Remedies
Author:
Susumu
Omi
Kazuya
Fujita
Takamichi
Maeda
page:
818
-
823
Thermal Cycling Induced Plastic Deformation In Solder Joints. Ii. Accumulated Deformation In Through Hole Joints
(Article)
Subject:
Thermal Cycle Stability
,
Plastic Deformation
,
Solder Joint Reliability
,
Accumulated Thermal Effect
Author:
Tsung-Yi
Pan
page:
824
-
832
Influence Of Environment On The Fatigue Of Pb-Sn Solder Joints
(Article)
Subject:
Fatigue
,
Pb-Sn Alloy
,
Solder Joint Reliability
,
Influence Of Environment
Author:
Hans
Conrad
A.F.
Sprecher
Dae Young
Jung
Zhenfeng
Guo
page:
833
-
837
Brittle Cracks Induced In Alsi Wire By The Ultrasonic Bonding Tool Vibration
(Article)
Subject:
Brittleness
,
Cracks Induced
,
Alsi Wire
,
Ultrasonic Bonding Tool Vibration
Author:
C. E
Miller
Raymond T.
Fitzsimmons
page:
838
-
842
Resistance Drift In Aluminum To Gold Ultrasonic Wire Bonds
(Article)
Subject:
Gold-Aluminum Bonds
,
Resistance
,
Drift
,
Ultrasonic Bonding Tool Vibration
Author:
Robert M.
Murcko
Robin A.
Susko
John M.
Lauffer
page:
843
-
847
High Mechanical Reliability Of Back-Ground Gaas Lsi Chips With Low Thermal Resistance
(Article)
Subject:
Gaas Lsi Chips
,
Thermal Resistance
,
Back-Ground
,
High Mechanical Reliability
Author:
Masanori
Nishiguchi
Noboru
Goto
Hideaki
Nishizawa
page:
848
-
854
Study Of Temperature Parameter On The Thermosonic Gold Wire Bonding Of High-Speed Cmos
(Article)
Subject:
Gold Wire
,
High-Speed Cmos
,
Temperature Parameter
,
Thermosonic
Author:
Kar P.
Foong
Thiam L.
Lim
G.E.
Lim
Shze J.
Hu
page:
855
-
858
Measurement And Modeling Of In Situ Lead Stiffness Of Surface Mounted Packages
(Article)
Subject:
Pcb
,
Test Method
,
Surface Mount Technology
,
Package Modeling
Author:
Praveen
Jain
W.E.
Jahsman
Elaine
Pope
page:
859
-
869
A Comprehensive Approach For The Analysis Of Package Induced Stress In Ic'S Using Analytical And Empirical Methods
(Article)
Subject:
Fem Model
,
Ic Packages
,
Empirical Models
Author:
Rajendra D.
Pendse
page:
870
-
873
A Bonding Technique For Thin Gaas Dice With Via Holes Using Gold-Tin Composites
(Article)
Subject:
Bonding Technique
,
Thin Gaas Dice
,
Gold-Tin Composites
,
Via Holes
Author:
Chen Y.
Wang
Chin C.
Lee
page:
874
-
878
Correlations Of Dynamic Mechanical Measurements To The Stress Formation By Molding Compounds
(Article)
Subject:
Correlation
,
Dynamic Mechanical Properties
,
Molding Compounds
,
Stress Formation
Author:
Raimund
Schwarz
Winfried
Holzapfel
Manfred
Bogner
Ferdinand
Quella
page:
879
-
885
Insulated Metal Substrates For The Fabrication Of A Half-Bridge Power Hybrid
(Article)
Subject:
Metal Substrate
,
Fabrication
,
Half-Bridge Converter
,
Hybrid Power System
Author:
R. Wayne
Johnson
Riley M.
Duren
page:
886
-
893
Downward Laser Trimming Of Thick Film Resistors
(Article)
Subject:
Analog Networks
,
Computer Simulations
,
Track Design
,
Thick Film Technology
Author:
M.
Satyam
T. Badri
Narayana
K.
Ramkumar
page:
894
-
899
Die Punch Test Study And Relationship To Delta Vbe
(Article)
Subject:
Relationship
,
Die Punch Test
,
Power Transistors
,
Delta Vbe
Author:
Lorena
Paredes-Casillas
Mariano
Aceves-Mijares
page:
900
-
903
A New Method To Determine Contamination Limited Yield
(Article)
Subject:
Determine Layer
,
Contamination
,
New Method
,
Limited Yield Modeling
Author:
Lewis
Hecht
page:
904
-
905
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